1, the UV laser is a cold light source, laser cutting or marking the thermal effects are very small, more suitable for heat sensitive materials affect further processing. 
2, UltraViolet laser has a narrower pulse widths and higher peak power, sapphire and other damage to the ceramic material a higher threshold is easy to break their destruction threshold, so it is easy to process demanding a high damage threshold molecular materials. 
3, UV laser focused spot Min.achievable 15UM, it is very suitable for micro drilling.